eve Conference Variant Block

  • (Day 1) December 11 (Thursday)
    8:00-8:50 Registration and refreshments
    8:50-9:00 Chairman’s opening speech

    Session 1 Trends of Film Material in 2008
    9:00-10:00 Panel Discussion: Film Material Research for paint-free technology in 2008
    10:00-10:30 Case study- How to Select the right film for the your products

    Section 2: Trends of Ink in 2008
    11:00-11:40 Valued-add printing with UV, UV coating in paint-free process
    *      Comparison between UV coating and traditional coating
    11:40-12:20 Panel Discussion: Will UV Coating replaces the traditional?
    12:20-13:20 LUNCHEON

    Section 3: Equipment for paint-free technology (Mold, Injection Molding Machine, Robotics, and so on)
    13:20-14:00 Paint-free Automation
    14:00-14:40 Robotics in paint-free technology
    14:40-15:20 How Mold design impacts efficiency of paint-free
    15:20-16:20 Panel Discussion: Equipments Selection for paint free
    *      Hear the experts tell what it takes in injection machines, robotics, and tooling to make IMD work
    16:20-16:50 COFFEE BREAK
    16:50-17:50 Workshop:In Mould Decoration (IMD) and In Mould Label that offer particular benefits to designers, processors
    *      and manufacturers of a wide range of products. Improved design flexibility and quality
    17:50 Cocktail Party (Close of the first day)

    (Day 2) December 12 (Friday)
    8:00-9:00 Registration and refreshments
    Session 4: Manufacturer lead to new trends
    9:00-9:30 Advanced paint-free technology for the 3C industry
    9:30-10:10 Panel Discussion: Reducing material and manufacturing costs sharing details of case study examples
    10:10-10:30 COFFEE BREAK

    Session 5: Color and Appearance
    10:30-11:00 Paint-free optimized design and structure in 3C and auto products
    11:00-11:30 How color additive get prefect effects in Paint-free
    11:30-12:10 PANEL DISCUSSION: Achieving the best results in IMD & IML Processing
    12:10-13:10 Luncheon

    Session 6: In-Mold Decorating: Thick-Sheet Forming (TSF)
    13:10-13:40 Introduction to Process and Applications of TSF
    13:40-14:40 PANEL DISCUSSION: Equipment for Thick-Sheet Forming
    14:40-15:10 COFFEE BREAK
    15:10-15:50 CAD and CAE in Paint-free Process
    15:50-16:20 Case Study:-Process for forming durable layer for Paint-free
    16:20-17:20 Panel discussion:How Mold replace Air and liquid as traditional transmit in forming process
    17:20 Close of Conference Day 2(The speaker list is subjected to finalize by onsite announcement)

Package Plan

Early Bird (Registration with payment before October 31, 2008):RMB 2,400 USD 370
Registration with payment after October 31, 2008:RMB 2,900 USD 430

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