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Present sponsors

Booth Sponsorship
TA
TA
An Hui Hengyuan Chemical Co., Ltd.
An Hui Hengyuan Chemical Co., Ltd.
SANDIVIK
SANDIVIK
Advertising Sponsorship
CHONGQING POLYCOMP INTERNATIONAL CORP.
CHONGQING POLYCOMP INTERNATIONAL CORP.
Speech Sponsorship
Autodesk
Autodesk

Package Plan

 

Registration Fee: USD 580/person

4 Pass get 1 free!


eve Conference Detail Testimonial





Wish Ringier Summit serve as a great platform to promote technology markets development!

This platform provides a very effective communication and interaction of the participants!

Wish Ringier Forum to become a high-quality forum in China Composite industry!

Off White X Max 97


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Please contact us:

 
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