Smart Label Flip Chip Bonder is a full automatic high speed RFID inlay production system. It provides an innovation in flip chip assembly technology for RFID inlays. The system is equipped with the smart robot-vision system to conduct the semi-conductor antenna feeding and antenna binding. Its application includes but not limited to tickets, luggage label, good management, logistics, military, library, manufacturing, retail, access control and identification etc. important fields. The system is modularized design with good quality, high precision and high performance/price ratio.Air Jordan XIII High